NASA-linked, MIT-trained founders’ nSWX raises US$2M for AI chip packaging

The race to build larger AI models has created a less glamorous but increasingly urgent problem: how to move heat and power through ever-denser chip packages without driving up cost, energy use and complexity. A Malaysian startup now wants to solve part of that problem at the material boundary level. Kuala Lumpur-based nanoSkunkWorkX (nSWX) has […] The post NASA-linked, MIT-trained founders’ nSWX raises US$2M for AI chip packaging appeared first on e27 .