Cadence extends its AI agents beyond chips with AuraStack for circuit boards and packaging

Integrated circuit and electronic hardware design company Cadence Design Systems Inc. today announced a new artificial intelligence agent that assists with packaging and system design, the step after silicon has been customized and produced, marking how chips and components get used in electronic devices. AuraStack, a super-agent within the company’s Allegro AI studio, provides agentic […] The post Cadence extends its AI agents beyond chips with AuraStack for circuit boards and packaging appeared first on SiliconANGLE .