Applied Materials and TSMC partner at EPIC Center to accelerate AI scaling

Building on more than 30 years of collaboration, Applied Materials Inc. announced a new innovation partnership with TSMC to accelerate the development and commercialization of semiconductor technologies required for the next era of AI. Working together at Applied’s EPIC Center in Silicon Valley, the companies will co‑innovate to advance materials engineering, equipment innovation, and process integration technologies designed to deliver energy-efficient performance from the data center to the edge. “Applied and TSMC share a long history of deep collaboration built on trust and a shared commitment to advancing innovation at the leading edge of semiconductor technology,” said Gary Dickerson, President and CEO of Applied Materials. “By bringing our teams together at the EPIC Center, we are strengthening that partnership and accelerating the development of technologies to address the unprecedented complexity driving the chipmaking roadmap.” “As semiconductor device architectures evolve wit